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Semiconductor Wafer Fabrication (Front-End)
Wet Clean
Wet Bench
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DI Water System
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Photolithography
Clean & Prep Wet Bench Station
Spin Processor
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Photomask Station
Mask Aligner System
Maskless Lithography System
Photomask
Physical Vapour Deposition
Sputtering System
Sputter Coater
E-Beam & Thermal Evaporation System
Close Space Sublimation System
Chemical Vapour Deposition
PECVD System
MOCVD System
LPCVD System
Gas Reactor System
Etching System
Dry Etching System
CCP-RIE System
ICP-RIE System
Atomic Layer Deposition
PE-ALD System
Thermal ALD System
Thermal System
Rapid Thermal Annealing System
Oxidation Furnace System
Diffusion Furnace System
Sublimation Furnace System
Wafer Testing System
Electrical Characterization System
Manual Probing Station
Automatic Probing Station
Cryogenic Probing Station
Hall Effect System
Laboratory Custom Measurement System
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Photoresist & Developer
IPA (Isopropyl alcohol)
BOE (Buffered Oxide Etchant)
Protective Workwear Clothing & Apparel
Sputtering Material
Crucible
Semiconductor Assembly (Back-End)
Wafer Mounting
Wafer Lapping and Polishing
Wafer Dicing System
Die Bonder System
Ball and Wire Bonding System
Tester and Handler System
Lead Plating System
IC Packaging System
Superconductor Solution
VSM
AC Susceptibility System
Cryogenic Probe Station
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Gaussmeter
Fluxmeter
Hall Probe & Sensor
Helmholtz Coil
Temp. Controller & Monitor
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DI Water Piping System
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Laboratory Custom Measurement System.
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