Wafer dicing, also known as wafer sawing or wafer cutting, is the act of dividing a silicon wafer into separate components known as die or chips. Wafer dicing allows producers of integrated circuits (ICs) and other semiconductor devices to harvest a large number of individual dice from a single wafer. Because of the incredibly tiny dimensions of the imprinted circuit traces on the wafer, the dicing process necessitates high-quality, high-precision technology as well as careful monitoring by professional operators with the necessary training and expertise. Because of the growing trend towards high-density electronics, which is driven by the need to pack more computer power into smaller packaging, the wafer dicing process will continue to improve as semiconductor manufacturing processes advance.
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