Wafer mounting is a step in the semiconductor production process that is performed during wafer die preparation. The wafer is put on a plastic tape that is fastened to a ring while in this phase. Wafer mounting occurs immediately before the wafer is sliced and divided into several dies. The sticky layer that holds the wafer in place guarantees that the individual dies stay securely in place during ‘dicing,’ as the process of cutting the wafer is known.
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