E-Beam Evaporation System
ITO & Metal Deposition Process
- Process: ITO & Metal deposition
- Substrate size for ITO: 2″(108pcs) wafer
- Substrate size for Metal: 2″(76pcs) wafer
- Materials: ITO,SIO2,Cr,Au,Pt,Ni,Ti & etc
- Evaporation Sources: E-Beam : 25cc (6pockets)
- Substrate temp: Max.250℃(Lamp Heating)
- Tickness uniformity: ≤±5%
- Substrate: 2inch (108pcs)
- Material Source: ITO
- Deposition rate: 2Å/sec
- Base Pressure: 2E-6Torr
- Reactive gas: O2
